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c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 4 - m a r . , 2 0 0 8 a p x 9 2 6 6 w w w . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e l i a b i l i t y o r m a n u f a c t u r a b i l i t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . s i n g l e - p h a s e f u l l - w a v e m o t o r d r i v e r f o r s i l e n t f a n m o t o r single phase full wave fan driver silent driver low supply current low standby current (pwm=0), supply current less than 200 m a speed controllable by pwm input signal built-in quick start function lock protection and auto restart function built-in fg output built-in hall bias circuit built-in thermal protection circuit lead free and green devices available (rohs compliant) t h e a p x 9 2 6 6 i s a s i n g l e - p h a s e f u l l - w a v e m o t o r d r i v e r f o r d c f a n m o t o r , a n d i t s s p e e d c a n b e c o n t r o l l e d b y p w m i n p u t s i g n a l . t h e o u t p u t s i g n a l o f t h i s i c i s t h e a m p l i f i e d h a l l i n p u t s i g n a l . i t i s s u i t a b l e f o r b o t h g a m e m a c h i n e a n d c p u c o o l e r t h a t n e e d s i l e n t d r i v e r s . t h e d e v i c e h a s l o c k p r o t e c t i o n f u n c t i o n a n d t h e l o c k - r e s t a r t t i m i n g c a n b e t u n a b l e b y c t c a p a c i t o r . t h e d e v i c e i s a l s o w i t h t h e r m a l s h u t d o w n f u n c t i o n . i n n o r m a l o p e r a t i o n , t h e s u p p l y c u r - r e n t i s l e s s t h a n 3 m a , b u t i n p w m = 0 s t a n d b y m o d e , i t i s j u s t a r o u n d 1 3 0 m a . m o r e o v e r , t h i s f e a t u r e w i l l s h u t - d o w n h b , a m p l i f i e r , a n d f g . t h e a p x 9 2 6 6 i s a v a i l a b l e i n m s o p - 1 0 p a c k a g e . f e a t u r e s g e n e r a l d e s c r i p t i o n a p p l i c a t i o n s motor drivers for silent fan motors o r d e r i n g a n d m a r k i n g i n f o r m a t i o n p i n c o n f i g u r a t i o n a b s o l u t e m a x i m u m r a t i n g s (note 1) symbol parameter rating unit v cc vcc pin supply voltage 7 v i out output pin output current 1 a v out output pin output voltage 7 v i hb hb pin output current 25 ma ct 2 in+ 3 8 v cc hb 4 6 fg 9 out1 7 pwm out2 1 in- 5 10 gnd msop-10 note: anpec lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with rohs. anpec lead-free products meet or exceed the lead-free requirements of ipc/jedec j-std-020c for msl classification at lead-free peak reflow temperature. anpec defines ?green? to mean lead-free (rohs compliant) and halogen free (br or cl does not exceed 900ppm by weight in homogeneous material and total of br and cl does not exceed 1500ppm by weight). apx9266 package code x : msop- 10 operating ambient temperature range i : -40 to 105 c handling code tr : tape & reel assembly material l : lead free device g : halogen and lead free device handling code temperature range package code xxxxx - date code apx9266 x : a9266 xxx xx assembly material
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 4 - m a r . , 2 0 0 8 a p x 9 2 6 6 w w w . a n p e c . c o m . t w 2 a b s o l u t e m a x i m u m r a t i n g s ( c o n t . ) symbol parameter rating unit v fg fg pin output voltage 7 v i fg fg pin sink current 10 ma r th, ja thermal resistance - junction to ambient msop - 10 192 c/w p d power dissipation (note2) 0.8 w t j junction temperature - 40 to 150 c t stg storage temperature - 65 to 150 c t sdr maximum lead soldering temperature, 10 second s 260 c note 1: absolute maximum ratings are those values beyond which the life of a device may be impaired. exposure to absolute maximum rating conditions for extended periods may affect device reliability. note 2: mounted on a board (48x38x1.6t mm, glass epoxy). r e c o m m e n d e d o p e r a t i n g c o n d i t i o n s symbol parameter ratings unit v cc vcc pin s upply voltage 2 to 5.5 v v hall hall input voltage range 0.2 to vcc - 1.1 v t a ambient temperature - 40 to 105 c e l e c t r i c a l c h a r a c t e r i s t i c s (v cc = 5v, t a =-25 c, unless otherwise specified ) apx9266 symbol parameter test conditions min . typ . max . unit supply current i hb = 5ma 1.2 1.3 1.4 v v hb hall bias voltage lock p rotect t off or pwm=0 - 0 - v i hb hb supply current - 15 20 ma t hbr hb r ecovery t ime none capacitor - 5 10 m sec i cc1 operating c urrent rotation m ode - 3 5 ma i cc2 standby supply current pwm=0 - 1 3 0 200 m a ct v cth ct pin high level voltage c ct =0.47 m f 1.4 1.3 1.5 v v ctl ct pin low level voltage c ct =0.47 m f 0.2 5 0.3 25 0.4 v i ct1 ct charge current v ct =0v 0.75 0.9 5 1. 15 m a i ct2 ct discharge current v ct =2v 0.1 3 0.1 6 0.1 9 m a r ct ct charge/discharge current ratio r ct =i ct1 /i ct2 5 6 7 pwm v pwmh pwm input h igh level voltage 2.5 - v cc +0.5 v v pwml pwm input l ow level voltage 0 - 1 v f pwm pwm input frequency 0.02 - 50 k hz
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 4 - m a r . , 2 0 0 8 a p x 9 2 6 6 w w w . a n p e c . c o m . t w 3 e l e c t r i c a l c h a r a c t e r i s t i c s ( c o n t . ) (v cc = 5v, t a =-25 c, unless otherwise specified ) apx9266 symbol parameter test conditions min . typ . max . unit output v ol output lower side saturation i o =250ma - 0.15 0.22 v v oh output upper side saturation i o =250ma - 0.15 0.22 v v fg fg pin low voltage i fg =3ma - 0.2 0.3 v i fg fg pin leak current v fg =5v - - 1 m a gain v hofs input offset voltage - 1 6 mv gio input ? output gain v o / (in+ - in - ) (ratio) 45 48 51 db thermal shutdown over temperature shutdown - 170 - ots over temperature shutdown hysteresis - 35 - c q uick start t qs qui ck start enable time - 66.5 90 msec
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 4 - m a r . , 2 0 0 8 a p x 9 2 6 6 w w w . a n p e c . c o m . t w 4 0 50 100 150 200 250 300 0 1 2 3 4 5 6 7 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s vcc supply current (ma) v c c s u p p l y v o l t a g e ( v ) v c c s u p p l y c u r r e n t v s . v c c s u p p l y v o l t a g e vcc supply current ( m a) v c c s u p p l y v o l t a g e ( v ) v c c s u p p l y c u r r e n t v s . v c c s u p p l y v o l t a g e fg pin current (ma) f g p i n l o w v o l t a g e ( v ) f g p i n c u r r e n t v s . f g p i n l o w v o l t a g e offset voltage (mv) a m b i e n t t e m p e r a t u r e ( c ) o f f s e t v o l t a g e v s . a m b i e n t t e m p e r a t u r e ct pin voltage (v) v c c s u p p l y v o l t a g e ( v ) c t p i n v o l t a g e v s . v c c s u p p l y v o l t a g e saturation voltage (v) o u t p u t c u r r e n t ( m a ) s a t u r a t i o n v o l t a g e v s . o u t p u t c u r r e n t 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 -40 -20 0 20 40 60 80 0 0.2 0.4 0.6 0.8 1 1.2 1.4 standby mode 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0 1 2 3 4 5 6 7 ct high level voltage ct low level voltage 0 0.5 1 1.5 2 2.5 3 3.5 4 0 1 2 3 4 5 6 7 operation mode 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 100 200 300 400 500 600 700 800 upper side mosfet low side mosfet
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 4 - m a r . , 2 0 0 8 a p x 9 2 6 6 w w w . a n p e c . c o m . t w 5 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 25 50 75 100 125 150 105 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 0 1 2 3 4 5 6 7 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s ( c o n t . ) ct charge/discharge current (ua) v c c s u p p l y v o l t a g e ( v ) c t c h a r g e / d i s c h a r g e c u r r e n t v s . v c c s u p p l y v o l t a g e hb voltage (v) v c c s u p p l y v o l t a g e ( v ) h b v o l t a g e v s . v c c s u p p l y v o l t a g e ct charge current ct discharge current maximum power dissipation (w) m a x i m u m p o w e r d i s s i p a t i o n v s . a m b i e n t t e m p e r a t u r e a m b i e n t t e m p e r a t u r e ( c ) o p e r a t i n g w a v e f o r m s r o t a t i o n w a v e f o r m 1 r o t a t i o n w a v e f o r m 2 out1(2v/div) out2(2v/div) pwm mode out1(2v/div) out2(2v/div) full speed t i m e ( 0 . 2 m s / d i v ) t i m e ( 0 . 2 m s / d i v ) in+(50mv/div) in-(50mv/div) in-(50mv/div) in+(50mv/div) 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0 1 2 3 4 5 6 7 i hb =5ma
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 4 - m a r . , 2 0 0 8 a p x 9 2 6 6 w w w . a n p e c . c o m . t w 6 t i m e ( 0 . 2 m s / d i v ) r o t a t i o n w a v e f o r m 3 r o t a t i o n w a v e f o r m 4 t i m e ( 0 . 2 m s / d i v ) t i m e ( 1 s / d i v ) l o c k p r o t e c t i o n w a v e f o r m 1 l o c k p r o t e c t i o n w a v e f o r m 2 t i m e ( 1 s / d i v ) full speed pwm mode out2(2v/div) out1(2v/div) fg(5v/div) out2(2v/div) out1(2v/div) fg(5v/div) out1(5v/div) out2(5v/div) ct(0.5v/div) fg(5v/div),always high out1(5v/div) out2(5v/div) ct(0.5v/div) fg(5v/div) o p e r a t i n g w a v e f o r m s ( c o n t . ) pin no. name description 1 out2 h - bridge o utput c onnection. the output stage is a h - bridge formed by four transistors and four - protection diode for switching applications. 2 ct shutdown time and restart time setting. 3 in+ hall input +. 4 hb hall bia s. 5 in - hall input - . 6 fg rotation speed output. 7 pwm pwm s ignal i nput t erminal . 8 vcc supply voltage input pin. 9 out1 h - bridge o utput c onnection. the output stage is a h - bridge formed by four transistors and four - protection diode for switching ap plications. 10 gnd power ground. p i n d e s c r i p t i o n i in (200ma/div) i in (200ma/div)
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 4 - m a r . , 2 0 0 8 a p x 9 2 6 6 w w w . a n p e c . c o m . t w 7 b l o c k d i a g r a m t y p i c a l a p p l i c a t i o n c i r c u i t note 3: in hot plug application, it?s necessary to protect against a hot plug input voltage overshoot. add an input zener d i o d e , between the vcc and gnd, to clamp the overshoot. i n n o r m a l o p e r a t i o n , t h e z e n e r d i o d e i s n ? t s t r e s s e d b e c a u s e o u t p u t c u r r e n t d o e s n ? t r e v e r s e t o v c c . tsd control hall bias discharge circuit out1 pwm out2 fg gnd ct vcc hb in+ in- 500 w 500 w 150k w 10k w 150k w vcc 90k [ 3 m a out2 gnd 1 2 3 4 5 6 7 8 9 10 in+ hb in- ct fg pwm v cc out1 hall pwm control signal v in 0.47 m f 1 m f d1 c1 d 2 6v r fg c ct zener fg output 10k w pull high voltage
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 4 - m a r . , 2 0 0 8 a p x 9 2 6 6 w w w . a n p e c . c o m . t w 8 f u n c t i o n d e s c r i p t i o n lockup protection and automatic restart the apx9266 provides the lockup protection and auto- matic restart functions for preventing the coil burnout in the locked fan. connecting the capacitor from ct pin to gn d determines the shutdown time and restart time. as the fan is locked the charge/discharge circuit, charg ing the ct capacitor to 1.3v by a 0.95 m a source current for a locked detectio n time and then switches the capacitor to discharge. during this discharge interval, the out- put driv ers are switched off until the ct voltage is dis - charged t o 0.325v by a 0.16 m a sink current and switches the cap acitor to charge. dur ing this charging interval, the ic en ters the restart time; one output is high and another is low, which makes a torque for fan rotation until the ct voltage is charged to 1.3v by a 0.95 m a source current. if the loc ked condition is not removed, the charge / discharge process will b e recurred until the locked con- dition is released (see figure 1. lockup protection and automatic restart waveform). quick start this ic disables the lock protection function when the pwm input keeps low level for more than 66.5ms (typ.) (see figure 2. quick start waveform). f i g u r e 1 . l o c k u p p r o t e c t i o n a n d a u t o m a t i c r e s t a r t w a v e f o r m in+ in- out2 out1 ct fg hb lock detection lock release toff ton toff 66.5ms (typ.) hb recovery time (typ.=5us) disable enable enable pwm lock protect enable (internal) hb out1 ct f i g u r e 2 . q u i c k s t a r t w a v e f o r m frequency generator function t h e f g p i n i s a n o p e n c o l l e c t o r o u t p u t , c o n n e c t i n g a p u l l u p r e s i s t o r t o a h i g h l e v e l v o l t a g e f o r t h e f r e q u e n c y g e n e r a t o r f u n c t i o n . d u r i n g t h e l o c k m o d e , t h e f g w i l l b e a l w a y s h i g h ( s w i t c h o f f ) . ( s e e t r u t h t a b l e ) o p e n t h e t e r m i n a l i s a t n o u s e . thermal protection t h e a p x 9 2 6 6 h a s t h e r m a l p r o t e c t i o n . w h e n i n t e r n a l j u n c t i o n t e m p e r a t u r e r e a c h e s 1 7 0 c , t h e o u t p u t d e v i c e s w i l l b e s w i t c h e d o f f . w h e n t h e i c ? s j u n c t i o n t e m p e r a t u r e c o o l s b y 3 5 c , t h e t h e r m a l s e n s o r w i l l t u r n t h e o u t p u t d e v i c e s o n a g a i n , r e s u l t i n g i n a p u l s e d o u t p u t d u r i n g c o n t i n u o u s t h e r m a l p r o t e c t i o n . lock protect function does not work if pwm input frequency is slower than 15hz (typ.). therefore, the pwm input frequency must be more than 20hz.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 4 - m a r . , 2 0 0 8 a p x 9 2 6 6 w w w . a n p e c . c o m . t w 9 input output in - in+ pwm ct out1 out2 fg mode l h h l l h l h l h off h l l l off l h l l l l l operation mode l h l l off h l - h l l off lock mode - - l - off off off standby mode t r u t h t a b l e a p p l i c a t i o n i n f o r m a t i o n input protection diode & capacitor i t s h o u l d b e a d d e d a p r o t e c t i o n d i o d e ( d 1 ) t o p r o t e c t t h e d a m a g e f r o m t h e p o w e r r e v e r s e c o n n e c t i o n . h o w e v e r , t h e p r o t e c t i o n d i o d e w i l l c a u s e a v o l t a g e d r o p o n t h e s u p p l y v o l t a g e . t h e c u r r e n t r a t i n g o f t h e d i o d e m u s t b e l a r g e r t h a n t h e m a x i m u m o u t p u t c u r r e n t . c o n n e c t i n g a c a p a c i t o r ( c 1 ) b e t w e e n v c c a n d g n d i s u s e d f o r a n o i s e r e d u c t i o n p u r p o s e ( s e e t h e a p p l i c a t i o n c i r c u i t ) . hb pin & hall input 1.3v reference is for hall element bias. in case vcc influences the hall signal by board wiring pattern, please connect 0.1 m f capacitor between hb and gnd. the supply current is just around 130 m a at pwm=0 standby mode. this feature will shutdown hb, amplifier and fg. the output signal of this ic is the amplified hall input signal, therefore, the output signal depends on hall input. when the hall input is small, the output signal becomes gentle. oppositely, the input signal is large, the output becomes steep (see figure 3. different of output signal depending on the shape of hall input signal).the input/ output gain is 48db (typ.). therefore, please adjust the amplitude of hall input to meet the adequate output voltage. in the case of long board wiring pattern from hall element to hall signal input terminal, please connect a capacitor between in+ and in-. (in+)-(in-) out1 (in+)-(in-) out1 f i g u r e 3 . d i f f e r e n t o f o u t p u t s i g n a l d e p e n d i n g o n t h e s h a p e o f h a l l i n p u t s i g n a l pwm input it is possible to change rotation speed of the motor by switching high side output transistor. the on-duty of switching depends on the input signal to pwm terminal. (see figure 4. pwm input waveform)
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 4 - m a r . , 2 0 0 8 a p x 9 2 6 6 w w w . a n p e c . c o m . t w 1 0 a p p l i c a t i o n i n f o r m a t i o n ( c o n t . ) the input level of pwm terminal is h : high side output transistor is on l : high side output transistor is off (see truth table). when pwm terminal is open, it is equal to high in+ pwm out1 out2 fg f i g u r e 4 . p w m i n p u t w a v e f o r m ct capacitor the capacitor that is connected from ct pin to gnd determines the shutdown time and restart time. pwm input (cont.) ct c w h e r e : = c t p i n c a p a c i t o r for example: c ct = 0.47 m f restart time=0.52s, shutdown time=3.13s the value of charge capacitor in range of 0.47 m f to 1 m f is recommended . f g r e s i s t o r t h e v a l u e o f t h e f g r e s i s t o r c o u l d b e d e c i d e d b y t h e f o l - l o w i n g e q u a t i o n : for example: v cc = 5v, i=3ma, v fg = 0.2v, r fg = 1.6k w the value of resistor in the range of 1k w to 10k w is recommended. thermal consideration refer to ?maximum power dissipation vs. ambient temperature?, the ic is safe to operate below the curve and it will eable the thermal protection if the operating area is above the line. for example, t a = 75 c, the maximum power dissipation is about 0.48w. the power dissipation can be calculated by the following equation: for example: i f v c c = 5 v , i c c = 4 m a , i o u t = 3 0 0 m a , v o u t 1 = 4 . 8 1 v , v o u t 2 = 0 . 1 7 v , t h e n p d = 0 . 1 2 8 w the gnd pin provides an electrical connection to ground and channeling heat away. the printed circuit board (pcb) forms a heat sink and dissipates most of the heat into ambient air. ( ) 1 ct ctl cth ct i v v c = time restart - i = r v v fg cc fg - ( ) 2 ct ctl cth ct i v v c = time shutdown - cc cc out 2 out 1 out cc d i v i ) v v v ( p + - = -
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 4 - m a r . , 2 0 0 8 a p x 9 2 6 6 w w w . a n p e c . c o m . t w 1 1 p a c k a g i n g i n f o r m a t i o n m s o p - 1 0 a 0 l view a 0 . 2 5 gauge plane seating plane a 1 d see view a e 1 e a 2 c e b s y m b o l min. max. 1.10 0.00 0.17 0.33 0.08 0.23 0.15 a a1 b c d e e1 e l millimeters a2 0.75 0.95 0.50 bsc msop-10 0.40 0.80 0.020 bsc min. max. inches 0.043 0.000 0.030 0.037 0.007 0.013 0.003 0.009 0.016 0.031 0 0.006 0 8 0 8 4.70 5.10 2.90 3.10 2.90 3.10 0.114 0.122 0.185 0.201 0.114 0.122 note: 1. follow jedec mo-187 ba. 2. dimension ? d ? does not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not flash or protrusions. 3. dimension ? e1 ? does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 6 mil per side.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 4 - m a r . , 2 0 0 8 a p x 9 2 6 6 w w w . a n p e c . c o m . t w 1 2 d e v i c e s p e r u n i t package type unit quantity m sop - 10 tape & reel 3000 c a r r i e r t a p e & r e e l d i m e n s i o n s application a h t1 c d d w e1 f 330.0 ? 2.00 50 min. 12.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 12.0 ? 0.30 1.75 ? 0.10 5.5 ? 0.10 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 msop - 10 4.00 ? 0.10 8.00 ? 0.10 2.00 ? 0.10 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 6.70 ? 0.20 3.30 ? 0.20 1.40 ? 0.20 (mm) h t1 a d a e 1 a b w f t p0 od0 b a0 p2 k0 b 0 section b-b section a-a od1 p1
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 4 - m a r . , 2 0 0 8 a p x 9 2 6 6 w w w . a n p e c . c o m . t w 1 3 test item method description solderability mil - std - 883d - 2003 245 c, 5 sec holt mil - std - 883d - 1005.7 1000 hrs bias @125 c pct jesd - 22 - b,a102 168 hrs, 100 % rh, 121 c tst mil - std - 883d - 1011.9 - 65 c~150 c, 200 cycles esd mil - std - 883d - 3015.7 vhbm > 2kv, vmm > 200v latch - up jesd 78 10ms, 1 tr > 100ma r e f l o w c o n d i t i o n ( i r / c o n v e c t i o n o r v p r r e f l o w ) c l a s s i f i c a t i o n r e f l o w p r o f i l e s profile feature sn - pb eutectic assembly pb - free assembly average ramp - up rate (t l to t p ) 3 c/second max. 3 c/second max. preheat - temperature min (tsmin) - temperature max (tsmax) - time (min to max) (ts) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 180 seconds time maintained above: - temperature (t l ) - time (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak /classification temperature (tp) see table 1 see table 2 time within 5 c of actual peak temperature (tp) 10 - 30 seconds 20 - 40 seconds ramp - down rate 6 c/sec ond max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. notes: all temperatures refer to topside of the package. measured on the body surface. t 25 c to peak tp ramp-up t l ramp-down ts preheat tsmax tsmin t l t p 25 t e m p e r a t u r e time critical zone t l to t p r e l i a b i l i t y t e s t p r o g r a m
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 4 - m a r . , 2 0 0 8 a p x 9 2 6 6 w w w . a n p e c . c o m . t w 1 4 table 2. pb - free process ? package classification reflow temperatures package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 +0 c* 260 +0 c* 260 +0 c* 1.6 mm ? 2.5 mm 260 +0 c* 250 +0 c* 245 +0 c* 3 2.5 mm 250 +0 c* 245 +0 c* 245 +0 c* * tolerance: the device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means peak reflow temperature +0 c. for example 260 c+0 c) at the rated msl level. c u s t o m e r s e r v i c e table 1. snpb eutectic process ? package peak reflow temperature s package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 240 +0/ - 5 c 225 +0/ - 5 c 3 2.5 mm 225 +0/ - 5 c 225 +0/ - 5 c c l a s s i f i c a t i o n r e f l o w p r o f i l e s ( c o n t . ) a n p e c e l e c t r o n i c s c o r p . head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan, r.o.c. tel : 886-3-5642000 fax : 886-3-5642050 t a i p e i b r a n c h : 2 f , n o . 1 1 , l a n e 2 1 8 , s e c 2 j h o n g s i n g r d . , s i n d i a n c i t y , t a i p e i c o u n t y 2 3 1 4 6 , t a i w a n t e l : 8 8 6 - 2 - 2 9 1 0 - 3 8 3 8 f a x : 8 8 6 - 2 - 2 9 1 7 - 3 8 3 8

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